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Materials Science of Thin Films: Depositon and Structure

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Great for hot and cold water, steam and grease-laden applications. These gaskets are low cost and, with certain grades of EPDM, available for use in applications where temperatures exceed 180 degrees. FKM O Rings Nothing leaves our plant without first being put through strict quality control measures, ensuring our customers only receive the highest-quality, fault-free products. Chapter 6 Chemical Vapor Deposition 6.1. Introduction 6.2. Reaction Types 6.3. Thermodynamics of CVD 6.4. Gas Transport 6.5. Film Growth Kinetics 6.6. Thermal CVD Processes 6.7. Plasma-Enhanced CVD Processes 6.8. Some CVD Materials Issues 6.9. Safety 6.10. Conclusion Exercises References Chapter 8 Epitaxy 8.1. Introduction 8.2. Manifestations of Epitaxy 8.3. Lattice Misfit and Defects in Epitaxial Films 8.4. Epitaxy of Compound Semiconductors 8.5. High-Temperature Methods for Depositing Epitaxial Semiconductor Films 8.6. Low-Temperature Methods for Depositing Epitaxial Semiconductor Films 8.7. Mechanisms and Characterization of Epitaxial Film Growth 8.8. Conclusion Exercises References

Chapter 11 Interdiffusion, Reactions, and Transformations in Thin Films 11.1. Introduction 11.2. Fundamentals of Diffusion 11.3. Interdiffusion in Thin Metal Films 11.4. Compound Formation and Phase Transformations in Thin Films 11.5. Metal-Semiconductor Reactions 11.6. Mass Transport in Thin Films under Large Driving Forces 11.7. Conclusion Exercises ReferencesChapter 2 Vacuum Science and Technology 2.1. Introduction 2.2. Kinetic Theory of Gases 2.3. Gas Transport and Pumping 2.4. Vacuum Pumps 2.5. Vacuum Systems 2.6. Conclusion Exercises References Chapter 7 Substrate Surfaces and Thin-Film Nucleation 7.1. Introduction 7.2. An Atomic View of Substrate Surfaces 7.3. Thermodynamic Aspects of Nucleation 7.4. Kinetic Processes in Nucleation and Growth 7.5. Experimental Studies of Nucleation and Growth 7.6. Conclusion Exercises References

Chapter 4 Discharges, Plasmas, and Ion-Surface Interactions 4.1. Introduction 4.2. Plasmas, Discharges, and Arcs 4.3. Fundamentals of Plasma Physics 4.4. Reactions in Plasmas 4.5. Physics of Sputtering 4.6. Ion Bombardment Modification of Growing Films 4.7. Conclusion Exercises References Easy to install and reliable, o rings are malleable in their nature. This means they can be slightly compressed between mating surfaces to obtain a perfect seal and proves significantly valuable where the mating surface has slight imperfections, because it allows the rubber to compress and fill any gaps that are present. Great for oil and grease-laden applications. These gaskets offer good resistance to ozone, ageing and are low gas permeable with great temperature prevail. Nitrile O Rings This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added. Chapter 1 A Review of Materials Science 1.1. Introduction 1.2. Structure 1.3. Defects in Solids 1.4. Bonds and Bands in Materials 1.5. Thermodynamics of Materials 1.6. Kinetics 1.7. Nucleation 1.8. An Introduction to Mechanical Behavior 1.9. Conclusion Exercises ReferencesChapter 12 Mechanical Properties of Thin Films 12.1. Introduction 12.2. Mechanical Testing and Strength of Thin Films 12.3. Analysis of Internal Stress 12.4. Techniques for Measuring Internal Stress in Films 12.5. Internal Stresses in Thin Films and Their Causes 12.6. Mechanical Relaxation Effects in Stressed Films 12.7. Adhesion 12.8. Conclusion Exercises References Index. Chapter 5 Plasma and Ion Beam Processing of Thin Films 5.1. Introduction 5.2. DC, AC, and Reactive Sputtering Processes 5.3. Magnetron Sputtering 5.4. Plasma Etching 5.5. Hybrid and Modified PVD Processes 5.6. Conclusion Exercises References

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